• Mantis Deposition Systems
  • Mantis Deposition Systems
  • Mantis Deposition Systems
  • Mantis Deposition Systems

Q Series (PVD)

Chamber

The all new Q Series range of platforms are based on our proven QPrep system technology offering UHV performance for PVD researchers utalising a conflat flange chamber.  This allows true UHV to be achieved while allowing excellent chamber access through the large top-flange.  The Q500 range all use the same proven technology whilst offering optimised characteristics depending on research specialisation and budget.  

All joints are internally welded to reduce to an absolute minimum any outgassing. Depending on specification the chamber includes a wide aray of in-situ analysis ports, such as ellipsometry, RGA and differentially pumped RHEED.  Base ports are confocal as standard allowing a wider variety and number of deposition sources to be employed than with non-confocal arrangements.  The Q500-FLEX has been specifically designed to incorporate our proprietary Nanoparticle source, alongside a wide range of primary PVD sources.

The system can be equipped with turbo pumps ranging from 400 to 1500ls-1 and alternative pump types such as cryopumps may be requested.

Applications

  • Magnetic materials
  • Semiconductor films
  • Dielectric materials
  • Nanostructured films
  • Catalytic materials
  • Device metallisation

Sample

Sample Loading

The base system is equipped with a side-entry door appropriately sized for the sample platform chosen and may include the option of a motorised flip-top lid for easy chamber access and cleaning.  Sample sizes are research specific and depending on model selected include FLAG, 2”, 4” and 6” sample sizes, with sample stage shutter.

As an option a load-lock can be mounted for clean sample transfer while leaving the main chamber under vacuum.  Sample transfer is actuated via a magnetically-coupled transfer arm. Sample hand-off is enabled via a z-shift lift-off on the sample table.

Sample Table

The sample table/manipulator can be configured as standard for FLAG, 2", 4”, 6" (or multiple smaller) samples.

Options

  • Variable speed (2-20rpm) sampled rotation
  • DC or RF sample table bias
  • Sample heating up to 800°C
  • Sample cooling
  • Z-shift (0-100mm)

The sample cradle in heated sample holders is manufactured of refractory materials.

Components

Sputtering Sources

The base ports have been arranged to accept 1-3" magnetron sputtering sources for DC, RF, Pulsed DC or HiPIMS operation. More details about our sources are available here.

Mini E-Beam Sources for low dose, extreme thickness control

These are intended for highly-controlled, ultra-thin film deposition of refractory materials into the system. See more details here.

Nanoparticle Sources

Our NanoGen50 nanoparticle source can be installed on the chamber to allow controlled nanoparticle deposition onto the sample. Nanoparticles can be generated from any metal as well as from many compound materials (oxides, nitrides, carbides...) and alloys.  More details are available here.

Atomic Sources

For the growth of oxides or nitrides at low pressure, it is often necessary to use a more reactive form of oxygen (and certainly nitrogen) to form oxide or nitride compounds.  These can be incorporated to act alongside conventional metal deposition sources to grow high-quality compound layers.  More info can be found here.

Thermal Sources

Thermal sources such as K-cells and Thermal Boats can be added.  K-cells will fit through standard ports and optional, water-cooled cross-contamination shields can be added around them to improve overall system purity.  More details on our MBE K-cells for metals and organics are available here and for our thermal boat source here.

 

  Q500-ORIGIN    Q500-FLEX      Q500-CREATOR    
CUSP Sputtering Source Max. 5 sources with up to 3” targetsMax. 7 sources with up to 3” targetsMax. 9 sources with up to 3” targets
NanoGen Nanoparticle SourceNoYesNo
MATS/RFM Atom/Ion SourceYesYesYes
Thermal Boat Source (TBS)Yes (instead of the central CUSP
Sputtering Source)
Yes (instead of the central CUSP
Sputtering Source)
Yes (instead of the central CUSP
Sputtering Source)
Mini E-Beam EvaporatorYes (instead of the central CUSP
Sputtering Source)
Max. 5 QUAD-EV SourcesPorts shared with Sputtering Sources
ComCell Effusion Cell SourcesPorts shared with Sputtering SourcesPorts shared with Sputtering SourcesPorts shared with Sputtering Sources
Thermal Gas Cracker Source (MGC)Ports shared with Sputtering SourcesPorts shared with QUAD-EV
Sources
Ports shared with Sputtering Sources

 

 

 

Accessories

Gauges
The system is configured as standard with full-range gauges to allow seamless monitoring.
Ports can be included for RHEED, ellipsometry, residual gas analysers or thin film monitors.
Optionally, additional analysis equipment can be included at the user's request.

Automation
The system can be automated using touchscreen-based pumpdown or using process automation feature in in-house developed software.

 

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